JPS6145849B2 - - Google Patents

Info

Publication number
JPS6145849B2
JPS6145849B2 JP53155840A JP15584078A JPS6145849B2 JP S6145849 B2 JPS6145849 B2 JP S6145849B2 JP 53155840 A JP53155840 A JP 53155840A JP 15584078 A JP15584078 A JP 15584078A JP S6145849 B2 JPS6145849 B2 JP S6145849B2
Authority
JP
Japan
Prior art keywords
cavity
mold
lead
component body
receiving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53155840A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5491751A (en
Inventor
Aasaa Ranburehito Richaado
Shii Meihyuu Aasaa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Union Carbide Corp
Original Assignee
Union Carbide Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/862,556 external-priority patent/US4155533A/en
Priority claimed from US05/862,553 external-priority patent/US4155532A/en
Application filed by Union Carbide Corp filed Critical Union Carbide Corp
Publication of JPS5491751A publication Critical patent/JPS5491751A/ja
Publication of JPS6145849B2 publication Critical patent/JPS6145849B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/72Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Ceramic Capacitors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP15584078A 1977-12-20 1978-12-19 Mold for wrappsealing parts with lead at certain angle to axis of parts Granted JPS5491751A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US05/862,556 US4155533A (en) 1977-12-20 1977-12-20 Mold for encapsulating a component having non-axial leads
US05/862,553 US4155532A (en) 1977-12-20 1977-12-20 Mold for encapsulating a component having a lead at an angle to the axis of the component

Publications (2)

Publication Number Publication Date
JPS5491751A JPS5491751A (en) 1979-07-20
JPS6145849B2 true JPS6145849B2 (en]) 1986-10-09

Family

ID=27127708

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15584078A Granted JPS5491751A (en) 1977-12-20 1978-12-19 Mold for wrappsealing parts with lead at certain angle to axis of parts

Country Status (4)

Country Link
JP (1) JPS5491751A (en])
DE (1) DE2854631C3 (en])
FR (1) FR2412396B1 (en])
GB (1) GB2010732B (en])

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6228792Y2 (en]) * 1980-08-26 1987-07-23
JP7351177B2 (ja) * 2019-10-28 2023-09-27 Tdk株式会社 セラミック電子部品
JP7428962B2 (ja) * 2019-10-28 2024-02-07 Tdk株式会社 セラミック電子部品

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3045290A (en) * 1957-10-11 1962-07-24 Anderson Controls Inc Method of encapsulating coils
US2934792A (en) * 1958-06-16 1960-05-03 Marco Ind Method of fabricating indicator light with molded nylon jacket
FR1272045A (fr) * 1960-07-04 1961-09-22 Dubilier Condenser Co 1925 Ltd Perfectionnements à la fabrication d'éléments électriques gainés
FR1458756A (fr) * 1965-10-19 1966-03-04 Gen Electric Perfectionnements aux machines à mouler
US3768945A (en) * 1967-08-23 1973-10-30 Eaton Corp Injection molding apparatus providing a strippable flash for producing a plurality of flash-free articles
US3542328A (en) * 1969-02-19 1970-11-24 Western Electric Co Mold having v-shaped guides to prevent pinching a lead on a component during an encapsulation process
US3739438A (en) * 1970-02-25 1973-06-19 Union Carbide Corp System for molding electronic components
US3838316A (en) * 1973-10-09 1974-09-24 Western Electric Co Encapsulated electrical component assembly and method of fabrication

Also Published As

Publication number Publication date
GB2010732A (en) 1979-07-04
FR2412396B1 (fr) 1985-08-23
FR2412396A1 (fr) 1979-07-20
JPS5491751A (en) 1979-07-20
DE2854631B2 (de) 1980-08-14
DE2854631A1 (de) 1979-06-21
DE2854631C3 (de) 1981-04-09
GB2010732B (en) 1982-05-12

Similar Documents

Publication Publication Date Title
US5108317A (en) Sealed metal shell connector and method of molding a plastic insert within a metal shell
US5861120A (en) Method of producing waterproof connector housing
JPS6145849B2 (en])
JPS6146042B2 (en])
US3530541A (en) Mold for encapsulating electrical components
US5004037A (en) Long span sprue tube for investment casting
DE4446658C2 (de) Verfahren zur Herstellung eines Steckers und Spritzform zur Durchführung des Verfahrens
US4155532A (en) Mold for encapsulating a component having a lead at an angle to the axis of the component
JP3088533B2 (ja) 射出成形用分配マニホールド
JPS55124633A (en) Manufacturing method of tubular vessel
JP7508865B2 (ja) 配線部材及び配線部材の製造方法
JPS636337B2 (en])
JPS6340282A (ja) 接続プラグの製造方法
JPS58212925A (ja) 射出成形金型
KR0124549B1 (ko) 반도체 어셈블리에서의 몰딩방법 및 몰드금형
JPS59121790A (ja) コネクタの製作方法
JPS58172958A (ja) 回転子のダイキャスト金型
JPH08197189A (ja) 完成中子の製造方法およびその部分中子
JPS61144033A (ja) 半導体装置の樹脂封止成形方法
JPH0134313Y2 (en])
JPH0134312Y2 (en])
JPS61102155A (ja) かご形回転子の製造方法
JPH0145188B2 (en])
JPH10144368A (ja) 分岐ケーブルの接続構造
JPS5882232U (ja) 模様成形用ノズル